3D键合质量及芯片缺陷检测AOI设备 3D Wire Bonding Defect AOI Equipment

设备简介:

具备3D AI 深度学习及分析算法,可提取并检测多种类型的不良缺陷

针对不同的器件可配置检测选型

大理石高精度直线电机运动平台，稳定可靠的检测环境

具备SECS/GEM 通讯接口

Equipment Introduction:

With 3D AI deep learning and analysis algorithms, it can extract and detect various types of defects and failures

Detection and screening can be configured for different devices

High precision linear motion platform, marble base, stable and reliable detection environment

SECS/GEM communication interface.

检测内容:

芯片表面异物、脏污等；

芯片破损、偏转、缺失、崩边、划痕等；

键合点缺失、偏移、旁边异物和沾污等；

键合线弧参数、空间距离、缺陷等

Detect content Technical Sp:

• Chip surface foreign materials, dirt, etc.;
• Chip crack or damage, deflection, missing, chipping, scratches, etc.;
• Bonding point missing, offset, foreign body and contamination, etc.;
• Wire arc integrity parameters, spatial distances, defects, etc.